BROOKLYN, – July 25, 2024 – Nanotronics, a global leader in advanced microscopy and automation solutions, is announcing the launch of nSpec ES, a more affordable educational version of its award-winning nSpec LS product line, which is powered by Nanotronics’ recently unveiled GEN V AI. This initiative is designed to support universities, research centers and semiconductor training programs with cutting-edge technology at preferential pricing to ensure broad access for America’s up-and-coming pool of advanced manufacturing talent.
The nSpec ES automated optical inspection system is equipped with Nanotronics’ proprietary Artificial Intelligence Software, nTelligence. This platform includes advanced tools providing industry-leading defect detection rates across wafers, substrates, and associated materials, plus enhanced software developed for educational and research purposes. With the ability to label and train research-specific classification models, the nSpec ES improves the capabilities of both students and researchers alike, providing fast feedback and compressed experimentation cycles to accelerate cutting-edge material and process research.
The system is packaged with Nanotronics’ Gen V AI, which is trained out of the box on over 10 years of computer vision data and millions of instances of defect detection from hundreds of global manufacturers – creating both an ideal teaching tool and an unmatched quality and process control solution.
Key Features of the nSpec ES:
- High-Resolution Imaging: Consistent resolution settings, ranging from 0.3 µm and higher, allowing for precise visualization and analysis of semiconductor structures.
- Advanced AI Software: nTelligence software not only detects defects but classifies them, helping assign causality while providing rapid feedback for process improvements.
- User-Friendly Interface: The platform’s intuitive software simplifies complex imaging tasks, making it accessible to users with varying levels of expertise.
- Versatile Inspection Capabilities: Semi-automated inspection for substrates, epi and patterned wafers, transparent and opaque materials, die on film tape, trays, gel-paks, waffle packs, photomasks, and sample fragments.
- Robust Analysis and Reporting: Customizable defect reports and analysis for defect detection and classification to streamline R&D efforts.
Supporting the CHIPS Act Initiatives
This initiative aligns with the objectives of the CHIPS Act, a historic federal program that has allocated over $52 billion to boost semiconductor manufacturing, research, and workforce development in the United States. The CHIPS Act aims to reduce dependency on foreign suppliers, enhance national security, and ensure a stable and resilient supply chain. By offering the nSpec ES at significantly reduced prices, Nanotronics will support academic institutions and training programs, enabling them to educate and train the next generation of semiconductor professionals.
With the launch of this initiative, Nanotronics aims to partner with the nation’s leading academic research institutions focused on semiconductor innovation.
“The CHIPS Act, which has enabled us to make this initiative a reality, is finally positioning America to be at the forefront of the semiconductor industry for future generations. Closing the talent gap is critical to the CHIPS Act’s success, and to ensure America’s continued technological dominance. The demand for next gen American talent in advanced manufacturing is growing, and we are excited to be a part of creating real solutions,” said Matthew Putman, CEO of Nanotronics.
Recent advanced software breakthroughs by Nanotronics have allowed the firm to offer its nSpec ES tool at a significantly reduced price. “We aim to equip research centers, universities, and semiconductor training programs with the cutting-edge tools they need to drive innovation and advance semiconductor technology as a whole. This initiative is about democratizing knowledge and leveraging our current lead in AI to offset issues America is facing, closing gaps we’d otherwise be facing around advanced manufacturing talent and capacity volumes.”
